The demands put on reliable solder joints are high. However, a wide variety of faults can occur during soldering that do not always seem to have a conclusive explanation, such as volume loss. A brief look at a completely different industry can bring useful insights. For example, the problem of crack formation due to volume loss in the construction industry can be used as a comparison, in that volume loss, for example, is not based on the evaporation of water, but on heat shrinkage. This has brought the concept of thermal expansion or thermodynamics into focus, which explains why soldered joints are subject to various disturbances. The video shows how the thermal expansion or thermodynamics can be influenced in such a way that it does not have a negative influence on the solder joint.
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Your contact person: Landulf Martin Skoda