Ultrasonic welding can reduce bonding pressure and temperature and improve the bonding process, which...
Read moreAn optimized die bonding setup for thermosonic bonding application (Tresky)
Rework of LED dies (Tresky)
Rework – barricades and technological processes (Kurtz Ersa)
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings (Plasmatreat)
If robots are to be used for complex soldering tasks of varying products, kinematics...
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