The production of electronic components is complex and combines many different manufacturing processes. In some cases, manufacturing processes are used that are rarely associated with electronic components, such as plastic molding. Many components have protective caps and covers made out of plastic, which in turn are manufactured using chemical agents that may not be compatible with electronics manufacturing. For example, mold release agents used in plastic manufacturing can cause conformal coating materials to no longer adhere and form a stable bond in electronics manufacturing. This is a challenge for electronics manufacturers, especially when this occurs between two component batches because the mold release agent has been changed during the plastic process. An exchange of components would be the solution, but is not always desired or possible. Solvent-based primers cannot be considered for cost and environmental reasons. Technical processes such as laser pre-treatment or CO2 snow blasting could be used, but these only result in cleaning of the surfaces, not in the activation that is necessary for a stable connection. A solution that does not damage the component but leads to very good, stable material connections is surface treatment using Openair-Plasma. This process can be used to produce stable, durable connections between component and coating material, even if there have been changes in the preliminary processes.
Do you have questions regarding this matter?
Your contact person: Nico Coenen
Company: Plasmatreat GmbH
