Sometimes do-it-yourself is faster. This applies to the production of printed circuit boards in the development and prototyping of electronic assemblies. Laser processes in particular can be used to produce single or double-sided printed circuit boards, multilayers, high-performance circuits, RF and microwave printed circuit boards as well as rigid and flexible printed circuit boards. Especially in prototyping, layout adjustments are occasionally necessary during the individual development steps. The laser structuring process is particularly well suited for the production of RF and microwave applications. In comparisons, laser-structured HF circuit boards perform better than circuit boards manufactured by etching in terms of precision, repeat accuracy and matching simulation results. To have these PCBs produced by an external manufacturer costs time and thus money, which can be saved by using an in-house production process. But in-house prototyping also has other advantages. The freedom to develop and experiment, revise, correct, fit and improve existing PCBs quickly and cost-effectively shortens R&D time and thus the entire market introduction process. Furthermore, confidential designs remain in-house.
Do you have questions regarding this matter?
Your contact person: Herr Lars Führmann
Company: LPKF Laser & Electronics AG
