Special alloys for the latest technologies and modern soldering requirements

Whereas in the past decades simple eutectic alloys of tin and lead were mostly used for electronic assemblies, which were still largely acceptable for components and printed circuit boards, since the RoHS conversion alloys have been used almost exclusively in which the lead has been replaced by a corresponding proportion of tin. Furthermore, silver and copper are also found in the standardised range in the low, single-digit range.

The disadvantage of this change, however, is a significantly higher temperature requirement, which is generally up to about 50K (°C) above the melting point of lead-containing alloys. This significantly higher energy must of course also be carried by the components and printed circuit boards, which is no longer a given with the miniaturization and complexity of many modern circuits. This is why the call for special alloys for the gentle production of assemblies is growing louder. At the same time, the higher energy consumption during production is of course a valid argument for offering alloys with significantly lower melting points, for example. Special alloys are also one of the challenges of our time with regard to the latest technologies, whether for modern energy generation with high performance or for the latest technologies in the automotive and medical sectors. Even before the conversion to RoHS, only a few solder manufacturers had dealt with the subject of such and other special alloys in terms of development technology and are now in a position to immediately meet the latest requirements in electronics and other segments. The new, target-oriented product configurator offers a convenient way of putting together the right, optimum alloys and solder products and is perfectly complemented by personal discussions with experienced employees and cooperation partners. These can provide competent advice on the professional and bureaucratic recycling of process waste.

No Result