Due to the continuous miniaturisation in the electronics industry, newly developed semiconductor chips are becoming smaller and thinner. In addition, new materials used to manufacture chips have been added. In the past, silicon (Si) or germanium (Ge) were used in most cases for semiconductor production. Particularly driven by the development of new generations of laser, LED, diode or transistor semiconductors, materials such as gallium arsenide (GaAs), gallium nitride (GaN) or, for example, silicon carbide (SiC), are now also being used. Some of these compound semiconductors, such as gallium arsenide (GaAs), have the disadvantage that they are not very stable mechanically and break quickly. This leads to enormous challenges in chip bonding in assembly and interconnection technology. For this reason, the first air-bearing bonding head for force-controlled placement of highly sensitive components has now been developed to realise minimal contact forces during bonding.
The air-bearing bond head enables a play- and friction-free movement in the vertical direction when placing the chip. The air bearing is kept in a floating state by vacuum or compressed air and is controlled by a proportional valve that can operate from vacuum to atmospheric pressure. The bond head recognises changing weights and can thus maintain the floating state at all times. This results in a weight compensation of the component. By changing the proportional valve from vacuum to pressure, a defined weight force can now be exerted in the vertical direction on the semiconductor component to be placed and placed or picked up with an exact force.
Sie haben Fragen zu diesem Thema?
Firma: TRESKY GmbH
Ihr Ansprechpartner: Daniel Schultze
