Thanks to prefabricated rings made of solder wire, a newly developed soldering or wire feeding process enables a new form of cycle-time-optimised, highly accurate and economically sustainable assembly soldering.
Specific solder rings are produced from commercially available solder wires with or without flux core by means of a fully automatic ring production device. The pre-assembled solder rings are then placed on and around THT pins and melted by means of laser, piston or induction soldering processes as well as IR emitters, hot air or thermodes. Depending on the tool used, solder wires of different diameters can be bent with specific ring diameters. The solder rings produced in this way can be positioned with the aid of special tweezers and magazine dispensers or automatically with highly dynamic pick & place on the solder joints to be soldered or via plated-through pin handlings. Because the amount of solder can be precisely adjusted, the high-precision soldering process is extremely sustainable.
With manual soldering as well as with the feeding of solder wire within laser, piston or induction soldering, even the smallest deviations lead to different soldering results. With the defined solder wires, a reproducible solder volume can always be provided on the basis of the wire thickness and the defined wire lengths. Since there is no cut-off, a solder wire reel can be processed at almost 100%. This is a decisive factor, especially in the field of manual soldering. After all, the amount of solder and flux can only be defined extremely imprecisely due to the time needed to solder the wire. The solder rings can be used to optimise manual or automatic soldering processes.
The new soldering process eliminates sources of error, reduces rejects and increases process accuracy. In addition, the energy required for melting can be precisely defined on the basis of the exact solder and flux volume of the solder rings. This reduces the energy requirement. Particularly in the case of high series production volumes, further savings can thus be achieved. Initial evaluations have already demonstrated significant cost reductions. These result from reduced wire waste, lower energy requirements, reduced machine wear, cycle time optimisation due to the elimination of heating times and immediate availability.
Furthermore, it is possible to integrate the module with the respective soldering module in a production cell and to integrate the specific soldering process inline into any existing process line. If the solder rings are flattened or oval-shaped in the wire diameter for narrow pins, they are also suitable for assembly in confined spaces. As evaluations have shown, the solder joints form cleanly and in a defined manner, independent of the solder ring diameter and the heat source. In addition, the solder miniscus forms precisely and reproducibly.
Another advantage is the process speed. Both individual steps can be carried out simultaneously by placing the solder rings independently of the actual soldering process. This decoupling is a factor that should not be underestimated in terms of cycle time optimisation, especially with high production volumes.
Sie haben Fragen zu diesem Thema?
Firma: EUTECT GmbH
Ihr Ansprechpartner: Matthias Fehrenbach