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Home INFO HUB Electronics

Contract manufacturing for die bonding prototyping and small batch production

10. January 2023
in Electronics, INFO HUB
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In the prototyping phase and in the production of small series or batch size 1, many companies shy away from investing in their own die bonder. Often, the final design process has not yet been completed, which is why downstream changes to the product or even to the manufacturing processes may be necessary. In such cases, the possibilities of contract manufacturing for prototypes and small batches by external service providers are all the more interesting.

Investments are not always made based on the respective project and development status. Additionally many customers want to be able to produce the prototypes and small series as quickly as possible and without any loss of quality. In these cases, they rely on service providers who can handle the production of sensitive electronic components with extensive experience and detailed knowledge. Based on a high level of technical know-how and years of experience in prototype and small series production, such requests can be implemented quickly and efficiently. Since all the necessary processes can be implemented in the existing demo center, for example at a die bonder manufacturer, customers have access to the full manufacturing spectrum. In addition to epoxy/adhesive die bonding, UV die bonding, ultrasonic bonding (US bonding), thermo compression bonding (TC bonding), sintering, die stacking, flip chip bonding, die sorting and eutectic bonding are offered by service providers.

Particularly at a time of high demand for components, the use of these services can be crucial for component manufacturers, because thanks to them, time-to-market can be reduced. As an external partner, the service provider can also quickly produce small batches on demand. On the customer side, it is therefore not necessary to build up additional production capacity, use existing resources or even interrupt series production. Customers thus receive the products they need and can also use the production process to test the performance of the die bonders. This also demonstrates reliable process options and provides customers with an individual demonstration including proof of production.

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Firma: Tresky GmbH

Ihr Ansprechpartner: Daniel Schultze

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Tags: DIE BondenPrototypingSemiconductor
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