Whitepaper (ENG): Rework – barricades and technological processes
Chip components are important elements in electronic production since the surface mount technology was introduced. Over the years the package size was constantly decreasing. The small resistors and capacitors are still required, even if chip designs and integration rates for integrated circuits are improving almost constantly as well. 0201 packages are state of the art in electronic production and smaller versions enter the markets rapidly. While production systems like screen printers and pick and place machines can handle the small chips perfectly, touch up and repair processes become more challenging and many questions arise. What are the obstacles in rework of 0201, 01005 components, which strategies and equipment lead to successful repair of these extremely small, and sensitive device?
Whitepaper (ENG): Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat and moisture. Typical coating formulations involve the use of epoxy, urethane and acrylic chemistries on polymer printed circuit boards (PCBs) leading to poor adhesion and failure to form void-free uniform coatings that follow the PCB skyline contour.
CircuitByte Smart Manufacturing with BOM Connector and Valor
Chip shortages, long delivery times and a general lack of certainty about the availability of components and their alternatives are significantly complicating the purchasing process for components for all electronics manufacturers at the present time.
Especially now, it is essential that digital processes enable simple, fast and consistent planning from purchasing to production. The BOM Connector Enterprise paired with the Siemens Valor products fulfils exactly these requirements of the market and enables the users a continuous Supply Chain 4.0.
Learn more about how you can manage the biggest challenges of supply chain disruption, product diversity, the risk of price increases between quote and order, and more.
Whitepaper: An optimized die bonding setup for thermosonic bonding application
Thermosonic bonding (TSB) is a die-to-die bonding method, which combines the novel thermocompression bonding together with ultrasonic (US) welding during the bonding process and, thus, utilizes the best quality of each for use in microelectronics bonding applications. Originally, TSB was mainly used in the wire bonding technology. The introduction of US enhances the bonding process by reducing the applied bonding pressure and temperature that are very attractive in semiconductor fabrication.
Whitepaper: Rework of LED dies
Process: The debonding process are performed by using scrubbing function, which has been modified in such a way that it breaks the adhesion between the LED die and the solder by using the heater temperature. After the LED die is separated from the solder, the tool pick the die using vacuum and then dump in the dump bin location.