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Plasmatreat: Openair-Plasma® for semiconductor and packaging

2. März @ 6:00 - 7:00

theme:

After participating in this PlasmaTalk you will know more about:

  • Differences vacuum and Openair-Plasma®
    – Which gases are typically used?
    – What cycle times are we talking about
    – Case study on cost of ownership
  • Successful applications:
    – Wire Bonding
    – Die Bonding
    – Pre-Molding
    – Thermal Compress Bonding
    – Reduction of Lead frames

Speaker: Nico Coenen

Date:

March 02, 2021

Timeslots (UTC): 6 am, 9 am pm, 4 pm

REGISTRATION

Details

Datum:
2. März
Zeit:
6:00 - 7:00
Veranstaltung-Tags:
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